DESCRIPTION
1 mil polyimide backing combined with a
conductive polymer coating and a semiconducting
silicone adhesive offers low
voltage discharge in dispensing and removal
of this tape in PCB masking applications.
Outstanding thermal resistance offers
excellent solder masking properties. This
product generates less than 50 volts discharge
as it is being dispensed and removed.
PRODUCT APPLICATIONS
This tape is used for wave solder and reflow
applications where low static, toughness,
puncture resistance, extreme resistance to
heat, and flame retardance are required.
Filename | Action |
ELEC_FM48_TDS.pdf | [ Download File ] |
Tech Specs | |
Backing | Polyimide Film |
Adhesive Type | Silicone/ Semi-Conducting |
Adhesion to Steel | 21 oz/in |
Tensile Strength | > 7.7 lbs/in |
Elongation | >50% |