DESCRIPTION
A pressure-sensitive masking tape designed
for use in extreme high temperature conditions.
The polyimide backing combined with
thermosetting silicone adhesive provides
superior flame and chemical resistance. Can
withstand exposure to temperatures up to and
in excess of 400°F (204°C).
PRODUCT APPLICATIONS
Masking gold fingers (printed circuit boards)
during wave solder operation. Can also be
used for powder coat masking.
Filename | Action |
ELEC_FM28_TDS.pdf | [ Download File ] |
Tech Specs | |
Backing | 0.025 mm Polyimide Film |
Adhesive Type | Silicone |
Adhesion to Steel | 25 oz/in |
Tensile Strength | 30 lbs/in width |
Elongation | 80% |