Saint-Gobain C680 Paper Pressure Sensitive Adhesive Tape

The C680 backing paper provides easy handling and removal from roll, and can be torn by hand, without cutting blades. It offers a resistance to flux chemicals and solder temperatures, removes cleanly, and is a great low cost replacement for high-temperature films. There is decreased static generation when tape is removed. Available with or without a liner. Manufactured from resin-impregenated paper backing material with high-temperature silicone blend pressure-sensitive adhesive.

Applications: C680 is a new high-perfromance and cost-effective alternative for solder protection of printed circuit board connector fingers. The unique combination of resin-impregnated paper with high-temperature, silicone blend adhesive on one side provides high solder temperature resistance without the tape becoming brittle, resists attack from solvents that make up today’s water soluble fluxes, and is easy to handle, apply and remove.