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3M 3305 Wafer De-Taping Tape
3M 3305 Wafer De-Taping Tape
3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ Wafer Support Systems (WSS) adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer. Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding.
Applications: wafer de-taping, electronics
| Filename | Action |
| Wafer De-Taping Tape 3305 for 3M WSS TDS_vF.pdf | [ Download File ] |
| Tech Specs | |
| Backing | Polyester film |
| Adhesive Type | Rubber adhesive |
| Total Thickness | 2.7 mils |
| Tensile Strength | 78.4 N/cm |
| Elongation at Break | 125% |
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